Produkter> Keramik Substrat> Blo Keramik Substrat> Laser schneiden 1mm 96% Alumina Keramik Wafer
Laser schneiden 1mm 96% Alumina Keramik Wafer
Laser schneiden 1mm 96% Alumina Keramik Wafer
Laser schneiden 1mm 96% Alumina Keramik Wafer
Laser schneiden 1mm 96% Alumina Keramik Wafer
Laser schneiden 1mm 96% Alumina Keramik Wafer
Laser schneiden 1mm 96% Alumina Keramik Wafer
Laser schneiden 1mm 96% Alumina Keramik Wafer
Laser schneiden 1mm 96% Alumina Keramik Wafer

Laser schneiden 1mm 96% Alumina Keramik Wafer

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    • Bezuelungsart: T/T,Paypal
    • Incoterm: FOB,CFR,CIF,FCA,CPT,CIP,DDU,EXW
    • Min. Uerdnung: 500 Piece/Pieces
    • Transport: Land,Air,Express
    • Port: Shenzhen Port,Hongkong Port
    Supply Fäegkeet & Zousätzlech Informatioun
    Additional Information

    VerpakungExportkarton

    Produktivitéit100,000 pcs/month

    TransportLand,Air,Express

    Place of OriginHunan, China

    Kapazitéit liwweren500,000pcs/month

    CertificatRoHS,REACH

    HS Code8547100000

    PortShenzhen Port,Hongkong Port

    BezuelungsartT/T,Paypal

    IncotermFOB,CFR,CIF,FCA,CPT,CIP,DDU,EXW

    Produktattributer

    Model No.As per customer's specification

    MarkJinghui Keramik

    Place Of OriginChina

    Types OfDielectric Ceramics, Insulating Ceramics

    MaterialAlumina, Zirconia

    FeaturesExcellent Insulation, Heat Dissipation

    CertificateISO9001:2015, RoHS, REACH

    ToleranceThickness To Be 0.02mm After Lapping

    ColorWhite, Pink, Balck, Ivory Optional

    Purity Option94.4% 95%, 99% Or 99.5% Alumina

    Precision ProcessLapping,Laser Scribing and Cutting

    ApplicationFor Power Electronic Modules

    Verpakung & Liwwerung
    Eenheeten ze verkafen: Piece/Pieces
    Package Typ: Exportkarton
    Bild Beispill:
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    Produkt beschreiwung
    Laser schneiden 1mm 96% Alumina Keramik Wafer D'Beschreiwung D'Corriem Wollef ass aus 96% Aluminium Oxide benotzt, awer 99%, 99% puristesch Uwendung. De reegelméissege Forming Prozess ass Type Goss wann d'Dicke vu Keramik substrate manner wéi 1,2mm ass. Et ass einfach de verschiddene Muster ze erreechen, verschidde Form mat héijer dimensionalen ACTORCECTCECOM ze erreechen, de Laser Scribumen. Op der anerer Säit ass de Formingsprozess trocken trocken dréckt an isostatesch...
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    Produkter> Keramik Substrat> Blo Keramik Substrat> Laser schneiden 1mm 96% Alumina Keramik Wafer

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